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MC10EP58, MC100EP58 3.3V / 5V ECL 2:1 Multiplexer
Description
The MC10/100EP58 is a 2:1 multiplexer. The device is pin and functionally equivalent to the EL58 and LVEL58 devices. The 100 Series contains temperature compensation.
Features
http://onsemi.com MARKING DIAGRAMS*
8 1 SOIC-8 D SUFFIX CASE 751 1 8 HEP58 ALYW G 8 KEP58 ALYW G
* 310 ps Typical Propagation Delay * Maximum Frequency > 3 GHz Typical * PECL Mode Operating Range: VCC = 3.0 V to 5.5 V * * * *
with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = -3.0 V to -5.5 V Open Input Default State Q Output Will Default LOW with Inputs Open or at VEE Pb-Free Packages are Available
1
8 1 TSSOP-8 DT SUFFIX CASE 948R
8 HP58 ALYWG G
8 KP58 ALYWG G
1
1
DFN8 MN SUFFIX CASE 506AA H K 5U 3P M = MC10 = MC100 = MC10 = MC100 = Date Code
1
5U MG G
4
1
A L Y W G
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
(Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
December, 2006 - Rev. 6
1
Publication Order Number: MC10EP58/D
3P MG G 4
MC10EP58, MC100EP58
Table 1. PIN DESCRIPTION
NC 1 8 VCC PIN Da*, Db* Da 2 1 MUX Db 3 0 6 Q 7 Q SEL* Q, Q VCC VEE NC EP SEL 4 5 VEE FUNCTION ECL Data Inputs ECL Select Inputs ECL Data Outputs Positive Supply Negative Supply No Connect Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open.
Figure 1. 8-Lead Pinout (Top View) and Logic Diagram
* Pins will default LOW when left open.
Table 2. TRUTH TABLE
SEL H L Data a b
Table 3. ATTRIBUTES
Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Human Body Model Machine Model Charged Device Model Pb Pkg Level 1 Level 1 Level 1 Value 75 kW N/A > 4 kV > 200 V > 2 kV Pb-Free Pkg Level 1 Level 3 Level 1
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC-8 TSSOP-8 DFN8 Flammability Rating Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Oxygen Index: 28 to 34
UL 94 V-0 @ 0.125 in 41 Devices
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MC10EP58, MC100EP58
Table 4. MAXIMUM RATINGS
Symbol VCC VEE VI Iout IBB TA Tstg qJA qJC qJA qJC qJA Tsol Parameter PECL Mode Power Supply NECL Mode Power Supply PECL Mode Input Voltage NECL Mode Input Voltage Output Current VBB Sink/Source Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Thermal Resistance (Junction-to-Ambient) Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm Standard Board 0 lfpm 500 lfpm <2 to 3 sec @ 248C <2 to 3 sec @ 260C 8 SOIC 8 SOIC 8 SOIC 8 TSSOP 8 TSSOP 8 TSSOP DFN8 DFN8 Condition 1 VEE = 0 V VCC = 0 V VEE = 0 V VCC = 0 V Continuous Surge VI VCC VI VEE Condition 2 Rating 6 -6 6 -6 50 100 0.5 -40 to +85 -65 to +150 190 130 41 to 44 185 140 41 to 44 129 84 265 265 Unit V V V V mA mA mA C C C/W C/W C/W C/W C/W C/W C/W C/W C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Table 5. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 2)
-40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 3) Output LOW Voltage (Note 3) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 2165 1365 2090 1365 Typ 28 2290 1490 Max 37 2415 1615 2415 1690 150 0.5 Min 20 2230 1430 2155 1460 25C Typ 30 2355 1555 Max 39 2480 1680 2480 1755 150 0.5 Min 22 2290 1490 2215 1490 85C Typ 31 2415 1615 Max 40 2540 1740 2540 1815 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 3. All loading with 50 W to VCC - 2.0 V.
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MC10EP58, MC100EP58
Table 6. 10EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 4)
-40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 5) Output LOW Voltage (Note 5) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 3865 3065 3790 3065 Typ 28 3990 3190 Max 37 4115 3315 4115 3390 150 0.5 Min 20 3930 3130 3855 3130 25C Typ 30 4055 3255 Max 39 4180 3380 4180 3455 150 0.5 Min 22 3990 3190 3915 3190 85C Typ 31 4115 3315 Max 40 4240 3440 4240 3515 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 5. All loading with 50 W to VCC - 2.0 V.
Table 7. 10EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = -5.5 V to -3.0 V (Note 6)
-40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 7) Output LOW Voltage (Note 7) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 -1135 -1935 -1210 -1935 Typ 28 -1010 -1810 Max 37 -885 -1685 -885 -1610 150 0.5 Min 20 -1070 -1870 -1145 -1870 25C Typ 30 -945 -1745 Max 39 -820 -1620 -820 -1545 150 0.5 Min 22 -1010 -1810 -1085 -1810 85C Typ 31 -885 -1685 Max 40 -760 -1560 -760 -1485 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Input and output parameters vary 1:1 with VCC. 7. All loading with 50 W to VCC - 2.0 V.
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MC10EP58, MC100EP58
Table 8. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 8)
-40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 9) Output LOW Voltage (Note 9) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 2155 1355 2075 1355 Typ 28 2280 1480 Max 37 2405 1605 2420 1675 150 0.5 Min 20 2155 1355 2075 1355 25C Typ 31 2280 1480 Max 39 2405 1605 2420 1675 150 0.5 Min 25 2155 1355 2075 1355 85C Typ 33 2280 1480 Max 42 2405 1605 2420 1675 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 8. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V. 9. All loading with 50 W to VCC - 2.0 V.
Table 9. 100EP DC CHARACTERISTICS, PECL VCC = 5.0 V, VEE = 0 V (Note 10)
-40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 11) Output LOW Voltage (Note 11) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 3855 3055 3775 3055 Typ 28 3980 3180 Max 37 4105 3305 4120 3375 150 0.5 Min 20 3855 3055 3775 3055 25C Typ 31 3980 3180 Max 39 4105 3305 4120 3375 150 0.5 Min 25 3855 3055 3775 3055 85C Typ 33 3980 3180 Max 42 4105 3305 4120 3375 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 10. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to -0.5 V. 11. All loading with 50 W to VCC - 2.0 V.
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MC10EP58, MC100EP58
Table 10. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = -5.5 V to -3.0 V (Note 12)
-40C Symbol IEE VOH VOL VIH VIL IIH IIL Characteristic Power Supply Current Output HIGH Voltage (Note 13) Output LOW Voltage (Note 13) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Input HIGH Current Input LOW Current 0.5 Min 20 -1145 -1945 -1225 -1945 Typ 28 -1020 -1820 Max 37 -895 -1695 -880 -1625 150 0.5 Min 20 -1145 -1945 -1225 -1945 25C Typ 31 -1020 -1820 Max 39 -895 -1695 -880 -1625 150 0.5 Min 25 -1145 -1945 -1225 -1945 85C Typ 33 -1020 -1820 Max 42 -895 -1695 -880 -1625 150 Unit mA mV mV mV mV mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 12. Input and output parameters vary 1:1 with VCC. 13. All loading with 50 W to VCC - 2.0 V.
Table 11. AC CHARACTERISTICS VCC = 0 V; VEE = -3.0 V to -5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 14)
-40C Symbol fmax tPLH, tPHL tJITTER VPP tr tf Characteristic Maximum Frequency (See Figure 2. Fmax/JITTER) Propagation Delay to Output Differential Cycle-to-Cycle Jitter (See Figure 2. Fmax/JITTER) Input Voltage Swing (Differential Configuration) Output Rise/Fall Times (20% - 80%) Q, Q 150 70 D to Q,Q SEL to Q,Q 200 Min Typ >3 Max Min 25C Typ >3 Max Min 85C Typ >3 Max Unit GHz ps 280 0.2 800 120 380 <2 1200 170 150 80 210 310 0.2 800 130 410 <2 1200 180 150 100 220 340 0.2 800 150 420 <2 1200 200 ps mV ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 14. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC - 2.0 V.
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MC10EP58, MC100EP58
1000 900 800 VOUTpp (mV) 700 600 500 400 300 200 100 0 10 9 8 7 6 5 4 3 2 1 5000 6000 JITTEROUT ps (RMS)
(JITTER) 4000
0
1000
2000
3000
FREQUENCY (MHz)
Figure 2. Fmax/Jitter
Q Driver Device Q
Zo = 50 W
D Receiver Device
Zo = 50 W 50 W 50 W
D
VTT VTT = VCC - 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.)
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EE EE
EEEEEEEEEE EEEEEEEEEE EEEEEEEEEE
MC10EP58, MC100EP58
ORDERING INFORMATION
Device MC10EP58D MC10EP58DG MC10EP58DR2 MC10EP58DR2G MC10EP58DT MC10EP58DTG MC10EP58DTR2 MC10EP58DTR2G MC10EP58MNR4 MC10EP58MNR4G MC100EP58D MC100EP58DG MC100EP58DR2 MC100EP58DR2G MC100EP58DT MC100EP58DTG MC100EP58DTR2 MC100EP58DTR2G MC100EP58MNR4 MC100EP58MNR4G Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) TSSOP-8 TSSOP-8 (Pb-Free) DFN8 DFN8 (Pb-Free) Shipping 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 100 Units / Rail 100 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 1000 / Tape & Reel 1000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices
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MC10EP58, MC100EP58
PACKAGE DIMENSIONS
SOIC-8 NB CASE 751-07 ISSUE AH
-X-
A
8 5
B
1
S
4
0.25 (0.010)
M
Y
M
-Y- G
K
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
C -Z- H D 0.25 (0.010)
M SEATING PLANE
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC10EP58, MC100EP58
PACKAGE DIMENSIONS
TSSOP-8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R-02 ISSUE A
8x
K REF 0.10 (0.004)
M
0.15 (0.006) T U
S 2X
TU
S
V
S
L/2
8 1
5
L
PIN 1 IDENT
4
B -U-
0.25 (0.010) M
0.15 (0.006) T U
S
A -V-
F DETAIL E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_
C 0.10 (0.004) -T- SEATING
PLANE
D
G DETAIL E
-W-
DIM A B C D F G K L M
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MC10EP58, MC100EP58
PACKAGE DIMENSIONS
DFN8 CASE 506AA-01 ISSUE D
D
A B
PIN ONE REFERENCE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 --- 0.25 0.35
2X
0.10 C
2X
0.10 C
0.10 C
8X
0.08 C
SEATING PLANE
A1
e/2
1 8X 4
L
K
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
CCC CCC CCC CCC
8
E
TOP VIEW
A (A3) C e
SIDE VIEW D2
E2
5 8X
b
0.10 C A B 0.05 C
NOTE 3
BOTTOM VIEW
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MC10EP58/D

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